• Availability of ACP and NCP products for different chip/bump types on various substrates • Curing in 4 sec from 140 °C at the adhesive, depending on substrate and equipment type • Approx. 15,000 uph are possible • Shear strength between 21 and 25 N (1x1 mm˛ chip) • Up to 10 million chips can be contacted with one kilogram of adhesive
DELO
