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Indium Hosted Global Technical Summit 2006
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| 3 October 2006 |
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Indium Corporation hosted its 4th Annual Global Technical Summit for their Technical Support and Applications Engineers in Clinton, New York, September 11-15th. Over 40 attendees from Asia, Europe, Mexico, and the United States participated.
The Technical Summit provided an opportunity for Indium’s global network of technical engineers to learn about new products, current research, and break-through developments in the industry, as well as to present case studies, share expertise, and network with each other.
The agenda also included presentations by Dr. Claudius Ferger, Manager of Advanced Plastic Packaging at IBM’s Thomas J. Watson Research Center, Dr. Ning-Cheng Lee, Vice President of Technology at Indium Corporation, and Dr. Ronald C. Lasky, Senior Technologist at Indium Corporation.
www.indium.com
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