Cookson Electronics Assembly Materials has won a Global Technology Award in the hand soldering – rework and repair category for ALPHA CoolCap devices.
“Tightly packed, high pin-count integrated circuits (ICs) are a considerable concern, often limiting the ability of process engineers to develop successful methods to replace ICs without disturbing the surrounding circuitry,” said Paul Keop, Cookson’s Global Product Manager. “To address this requirement, we have introduced the ALPHA CoolCap and CoolShield devices, designed to protect adjacent components from excessive heat proximal to a thermal rework event. CoolCap devices are available for most popular BGA and QFP devices.”
