Ultrapure K100LD • Silver-free lead-free alloy primarily manufacturing products & equipment MATERIALs containing tin and copper with the inclusion of metallic dopants to control the grain structure and the Copper dissolution rate • Copper dissolution rate 20 percent slower than the competitive SnCuNi alloy and even Sn63Pb37 • Offers anti-drossing technology, bright, smooth solder joints with no visible shrinkage effects, good through-hole penetration and topside fillet with virtually no bridging, and reduced leaching of solder pot materials • Compatible with all types of board and component metallizations, including SnCuNi alloys • Lead level is specified at less than 0.05 percent, ensuring RoHS compliance Kesterwww.kester.com
