Finetech has formed a new technical partnership with Technical Product Trade (TPT) located in Wessling, Germany to offer manual and semiautomatic wire bonders in the North American market. The bonders are capable of wedge and ball bonding in one machine, by changing the bond tool and selecting the appropriate mode via software. Conversion between ball and wedge bonding takes less than three minutes. These bench-top systems are suitable for small production, prototyping and R&D environments.
