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Monday, October 13, 2008
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Go to EM Asia (China)
 
POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
PRINT EDITION > JANUARY 2007
Sponsored Links

Dual wire bonders

1 January 2007

HB16/HB05

• Capable of wedge and ball bonding in one machine, simply by changing the bond tool and selecting the appropriate mode via software
• Bench-top systems are suitable for small production, prototyping and R&D environments
• HB16 Wire Bonder is an advanced, semiautomatic wire bonder with motorized Y & Z travel that provides controllable loop shape with high repeatability
• HB05 Wire Bonder is a flexible, manual wire bonder
• Both models offer deep-access bonding (16mm) using a longreach transducer, with the wire clamp positioned above the bonding tool

Finetech Electronic GmbH
www.finetech.de
 
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