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Ten Companies Selected by IPC for New Technologies
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| 1 March 2007 |
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IPC — Association Connecting Electronics Industries announces the companies launching revolutionary technologies at this year’s Innovative Technology Center (ITC). Featured at the 2007 IPC Printed Circuits Expo, APEX and the Designers Summit at the Los Angeles Convention Center, the ITC showcases new and emerging technologies from all segments of the electronics interconnect industry, including assembly, printed circuit board manufacture and design.
The companies and products selected as ITC award winners for their cutting-edge technologies are:
Baker Company, M.E. — Roll-to-Roll (R2R) Selective Vertical Plater (SVP)
COMET North America — FEINFOCUS COUGER PRO
DEK — 3D Find-a-Part Software
DEK — Cyclone Performance Under Stencil Cleaning
Enercon Industries — Atmospheric plasma surface treatment technology
Mentor Graphics — Topology Planner and Router
Optimal Electronics Corporation — Optel Dynamic Scheduling & Optimization
phoenix І x-ray Systems + Services, Inc. — nanotom
Photo Stencil — Area Ratio Calculator Tool
Speedline Technologies, Inc. — Camalot FX-D
www.ipc.org
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