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Sunday, October 12, 2008
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As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
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NEWS > MARCH 2007
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Ten Companies Selected by IPC for New Technologies

1 March 2007

IPC — Association Connecting Electronics Industries announces the companies launching revolutionary technologies at this year’s Innovative Technology Center (ITC). Featured at the 2007 IPC Printed Circuits Expo, APEX and the Designers Summit at the Los Angeles Convention Center, the ITC showcases new and emerging technologies from all segments of the electronics interconnect industry, including assembly, printed circuit board manufacture and design.

The companies and products selected as ITC award winners for their cutting-edge technologies are:
  • Baker Company, M.E. — Roll-to-Roll (R2R) Selective Vertical Plater (SVP)

  • COMET North America — FEINFOCUS COUGER PRO

  • DEK — 3D Find-a-Part Software

  • DEK — Cyclone Performance Under Stencil Cleaning

  • Enercon Industries — Atmospheric plasma surface treatment technology

  • Mentor Graphics — Topology Planner and Router

  • Optimal Electronics Corporation — Optel Dynamic Scheduling & Optimization

  • phoenix І x-ray Systems + Services, Inc. — nanotom

  • Photo Stencil — Area Ratio Calculator Tool

  • Speedline Technologies, Inc. — Camalot FX-D


  • www.ipc.org

     
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