IPC Issues 2006-2007 International Technology Roadmap for Electronic Interconnections
8 April 2007
IPC — Association Connecting Electronics Industries has announced the release of the “2006–2007 IPC International Technology Roadmap for Electronic Interconnections.” Published every two years, the IPC Roadmap provides vision and direction for product and process development and services to satisfy the informational needs of companies manufacturing substrates and assemblies.
“The IPC International Technology Roadmap focuses on the printed circuit board and electronics assembly industries,” said Dieter Bergman, IPC’s director of technology transfer. “While a view from 20,000 feet can provide a valuable, broad brush of information, IPC’s Roadmap is purposely designed to provide meaningful insight at an operational level — so companies gain acute understanding for virtually every operation on the manufacturing floor.”
The Roadmap is available as a free download to IPC members and can also be purchased in a CD format.
