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SMTA China Announces Call for Papers for 2007 Conference
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| 20 May 2007 |
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SMTA China invites industry members to participate in the SMTA China South Conference, which will be held 27-31 August 2007. The conference will be held in conjunction with Nepcon South China and will address the industry’s most pressing issues concerning electronics manufacturing, advanced packaging and lead-free reliability.
SMTA China is calling for technical papers as well as full- and half-day short courses. The abstract, author biography and PowerPoint presentation must be submitted in both English and Chinese, and will be included in the conference proceedings. All presentations must be made in Chinese.
Topics of interest include 01005 assembly, 3-D SiP (System in Package), PoP (Package on Package), Lead-free Reliability, Component Supply Integrity, Legal Responsibility of Non-RoHS Parts/Products Entering Europe, Materials and Process Characterization, and Flex Circuit Assembly.
Source: Company Release
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