| Multi-chip die bonding: 2200 evo |
•Dispenser and bonding system work in parallel in a single module for throughput up to 7,000 cph • Highly flexible with a footprint of 116x122cm • Process up to 25 different 300mm wafers in single pass • 14 different pick-up tools and 5 different ejection tools are additionally available in one module • For die attach and also a flip-chip bonder • Heatable bonding tool for stacked-die applications • Broad handling range from 250μm small up to 50mm large dies • Enables production of SiPs with all kinds of active and passive components in a single pass Datacon
www.datacon.at |  |
