| Full strength solvent blend: CYBERSOLV C8622 |
• Designed as an IPA alternative in stencil wiping and manual bench top cleaning applications • Removes solder pastes, spray fluxes and many adhesives used in electronics assembly • Features an operating concentration of 100 percent, an ambient optimum temperature, does not require a rinse and can air dry • Biodegradable solvent solution and contains no CFCs • High flash point (144°F) compared to IPA (55°F) making it a safe replacement • Material is non-flammable and non-corrosive, and is for use only in systems designed to operate flammable liquids Kyzen Corporation
www.kyzen.com |
