| CSP underfill system: Loctite 3536 |
• Advanced underfill material designed to enhance the reliability of modern hand-held devices • High flow, lead-free compatible designed to quickly fill the space beneath the CSP and BGA packages • Cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing to increase device throughput • Compatible with lead-free solder materials to allow for an increased process window and is reworkable The electronics group of Henkel
www.henkel.com/ electronics |  |
