DEK Lands Two Industry Awards for Packaging Solutions
25 July 2007
DEK announces that it was the recipient of two acclaimed industry awards at Semicon West held recently in San Francisco, California, USA.
The company was honored with an Editors’ Choice Award from Semiconductor International magazine for its Galaxy DirEKt Ball Placement system. According to DEK, the technology offers semiconductor specialists the ability to deposit solder spheres at substrate- and wafer-level, allowing placement of solder balls as small as 0.2mm in diameter at 0.03mm pitch and delivering first pass yields of over 99 percent.
DEK also picked up an Advanced Packaging Award for its Virtual Panel Carrier (VPC) -- a substrate centering and transport technology that is said to deliver parts stability and ease-of-use.
“Technical advancement and engineering expertise are cornerstones of DEK’s ‘Expect More’ philosophy and key components of our long-term success,” comments DEK CEO, John Hartner. “It is very gratifying to know that the industry has also recognized our efforts and selected DEK’s Galaxy DirEKt Ball Placement and VPC systems for two such prestigious awards.”
