Henkel to Share Materials Knowledge Base at Upcoming IPC and SMTA Events
19 September 2007
Henkel announces that it will not only showcase its latest materials innovations, but will also use each opportunity to share its materials knowledge base with show delegates at the forthcoming IPC Midwest and SMTA International electronics events. According to the company, top Henkel research and applications staff will present the company’s latest findings and insight into new, process-enabling materials developments.
At both shows, Henkel’s complete line of PCB assembly value chain materials solutions – from Chipbonder adhesives through to the latest Multicore lead-free solder pastes – will be on display. Another highlight of the Henkel booths will be the company’s portfolio of lead-free solder pastes. Though the industry is well underway with lead-free manufacturing, certain challenges still remain. Henkel recognizes these issues and has developed a line of lead-free materials designed to optimize modern production processes, the company said. Experts will be on hand to discuss the company’s low-voiding lead-free Multicore solder paste materials, next-generation Pb-free compatible underfill systems including the Cornerbond and Edgebond technologies, as well as the latest flux advances.
