Host of Companies to Present at SMTA International 2007

Dedicated to surface mount, advanced packaging and related technologies, the 2007 SMTAI Conference and Exhibition, scheduled to take place October 7-11, 2007, in Orlando, FL, USA, will focus on lead-free, SMT, process control, flip chip, chip scale, BGA, RoHS compliance, harsh environments and more. Additionally, the event will feature an encompassing technical conference organized by the SMTA with more than 100 technical papers from global experts, 26 tutorials, special symposiums on global RoHS, contract manufacturing and lead-free soldering technologies.

David Suihkonen, President of R&D Technical Services, and Atul Mehta, Senior Engineer at Jet Propulsion Laboratory in Pasadena, CA, will present “Vapor Phase, A Current Overview and Its Application for Lead-Free Reflow.”

Mike Bixenman, Kyzen’s chief technology officer, and Steve Stach of Austin American Technology Corp. will present “A New Programmable Test Platform for Cleaning Process Enhancement". Mike also will co-present “Using Six Sigma Techniques to Optimize Cleaning in Class III Electronics” with Tom Gervascio of Sypris Electronics and Ron Lasky, Ph.D., of Indium Corporation of America and Dartmouth College.

Peter Biocca, Kester’s Senior Market Development Engineer, and Randy Schueller, Ph.D. at Dell Corp., will present “Lead-Free Reflow Soldering Process: Resolving the Process Issues”. Additionally, Peter will present “Lead-Free Rework — Practical Experiences with SAC and SnCu Solders”.

For more information about the conference and exhibition, visit www.smta.org/smtai/.

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