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APR-5000-DZ • Rework system for BGA and SMT rework • Delivers highly targeted and controlled heating for rework of high thermal demand boards including lead-free and multilayer assemblies up to 12” x 12” (305mm x 305mm) • Enables fast ramp and tighter delta temperature control without affecting adjacent and underside components • System expands capability to rework odd-form and temperature sensitive components • Intuitive software and user prompts simplify training and provide repeatable process control OK International
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