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Sony Group Expands High-Performance Semiconductors Manufacturing Alliances with IBM and Toshiba
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| 22 October 2007 |
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Sony Corporation and Sony Computer Entertainment Inc. (Sony Group) announced two new and separate partnership agreements with the goal of enhancing the capabilities of Sony Group’s PlayStation business.
IBM and Sony have signed an agreement to extend their existing manufacturing relationship to 45-nanometer silicon-on-insulator (SOI) for high volume production of the Cell Broadband Engine (Cell/BE) processor. Both companies will collaborate to optimize the 45-nanometer manufacturing capability to produce a lower power and lower cost processor for Sony Group’s PlayStation3. IBM will lead the evolution of the Cell/BE component by transitioning production from the existing 65-nanometer generation to 45-nanometer in IBM’s manufacturing facility in East Fishkill, New York.
Separately, Sony Group will extend their alliance with Toshiba to manufacture high-performance LSI by using 45-nanometer bulk process technology. By forming a joint venture company that leverages the knowledge and experience of both companies, Sony Group and Toshiba intend to improve power consumption and cost competitiveness for game and digital media applications by advancing to the 45-nanometer generation from the existing 65-nanometer generation process.
Sony Group said it will advance the high-performance semiconductors used for PlayStation while reducing costs by further strengthening its collaboration with its respective partner companies. These enhancements will continue to strengthen the leading capability of the PlayStation3 system and Sony Group’s overall PlayStation business.
www.sony.net |
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