IPC and JEDEC to Host Technical Conference on Going Green

Hot environmental topics affecting manufacturers in today’s marketplace include electronic waste and recycling, lead free, low halogen and energy use. IPC — Association Connecting Electronics Industries and JEDEC will host a technical conference to examine the drivers behind “green” trends, including environmental directives and regulations such as RoHS, REACH and EuP, as well as consumer and nonregulatory pressures.

The conference, titled “The Challenges of Going Green,” will be held January 7, 2008 at the Las Vegas Convention Center in Las Vegas, in conjunction with the Consumer Electronics Show. More than a dozen industry experts will cover environmental, cost and technical implications of the regulations, while major original equipment manufacturers, such as Hewlett-Packard, Texas Instruments and Intel Corporation will provide an overview of their environmental roadmaps.

Conference topics will include issues related to lead-free rework, evolving environmental strategies, eco-technology opportunities, cost-effective approaches to environmental compliance and global environment, health and safety directives and regulations impacting electronics.

“The PCB industry is painfully aware of the impact of ‘going green’ on their pocketbooks, not to mention all the extra resources needed to comply with environmental regulations. IPC and JEDEC hope participants learn valuable information from the seminar that they can apply directly to their own production processes,” says Jean Hebeisen, IPC Director of professional development.

For more information on the technical conference, visit www.ipc.org/gogreen or contact Alexandra Curtis, Professional Development Manager at AlexandraCurtis@ipc.org.

www.ipc.org