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Nihon Superior to Present During the 2007 IPC/JEDEC International Conference on Lead-Free Electronics
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| 3 December 2007 |
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Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the IPC/JEDEC International Conference on Lead-Free Electronics and Tabletop Exhibition that is scheduled to take place December 3-5, 2007 in Austin, Texas, USA.
Nihon Superior’s presentation will take place on December 4, 2007 at 10:45 a.m. The paper, “Impact Strength of Lead-Free BGA Spheres,” will be presented by Keith Sweatman.
Additionally, Nihon Superior will have a tabletop exhibition. A company representative will be available to discuss the company’s products and technologies.
With the RoHS directive in place, the demand for advice and solutions is increasing dramatically, according to the organizers. IPC and JEDEC say they are holding this international lead-free conference to give the electronics industry answers to the challenges of implementing lead-free processes.
www.nihonsuperior.co.jp
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