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CDS6700 • Dispenser with the new piezo flow valve (PFV) for solder paste dispensing • Dispensing of liquids filled with ductile particles (such as solder paste or silver-filled glue) • Dispensing of solder paste dots as small as 100μm (4 mil) • Prototype dispensing instead of printing in SMT assembly and versatile use of the dispensing system for other applications with short changeover times • Targeted to startup SMT manufacturers with small series, flex circuit electronics manufacturers (e.g., sensors), membrane keyboard manufacturers and the general assembly industry Essemtec AG
www.essemtec.com | 
