Nihon Superior to Present at the 2008 Pan Pacific Symposium

Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the 13th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that is scheduled to take place January 22-24, 2008 at the Sheraton Kauai Resort, in Kauai, Hawaii.

Nihon Superior’s presentation will take place during Session WA1 in the Mechanical Integrity of Assemblies tract. The paper, “Strength of Lead-Free BGA Spheres in High-Speed Shear Loading,” will be presented by Keith Sweatman, Shoichi Suenaga and Tetsuro Nishimura on Wednesday, January 23, 2008.

The Pan Pacific Microelectronics Symposium & Tabletop Exhibition promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Sponsored by the Surface Mount Technology Association (SMTA), the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.

www.nihonsuperior.co.jp