New Siplace Application Center in Shanghai Opens Its Doors

On December 6, 2007, the new Siplace Application Center in Shanghai opened its doors with a formal ceremony. According to Siemens, customers in China are now able to test manufacturing solutions for their products in a realistic production environment and compare Siplace’s offerings against those of the competition before they invest in new equipment. The 90-percent utilization rate of Siplace’s worldwide application centers is an indicator of the high expertise, openness and reliability of the company’s application center teams, Siemens said.

The Siplace Application Center in Shanghai is equipped with a complete SMT line consisting of high-end Siplace X-Series machines, a DEK printer, a Rehm reflow oven and Asys board handling systems. Additionally, the digital Siplace D-Series, which just won the Vision Award 2007 and Frost & Sullivan’s Award for Technology Innovation 2007, demonstrates Siplace hightech innovations for standard and high-performance applications at an attractive price-performance ratio. The Application Center focuses especially on forward-looking technologies such as 01005 placement, CSP stacking, IC and BGA placement with 3-D coplanarity checking as well as the placement of exotic components. Siplace customers will have access to expert knowhow regarding all NPI processes and Siplace software solutions at the new center.

Siplace Application Centers are located in Munich, Shanghai, Singapore and Norcross, Georgia. These centers exhibit the wide performance spectrum of Siplace manufacturing solutions, and their experts use customer products to demonstrate the Compare values determined in advance, for example for feeder changeover times or the entire NPI process. Each application center has been designed to best meet the requirements of its specific market. The centers are even able to produce customer-specific circuit boards in realistic manufacturing conditions under the expert supervision of experienced Siplace production specialists.

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