Nihon Superior to Exhibit at Internepcon Japan 2008

Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase its SN100C paste at the upcoming Internepcon Japan exhibition, scheduled to take place January 16-18, 2008 in Tokyo Big Sight, Japan.

Developed specifically for the lead-free process of mass soldering, SN100C operates under process conditions similar to those of conventional lead containing alloys. According to the company, SN100C is outperforming competitive products in Japan, Asia, China, USA and Europe, with increasing numbers of leading manufacturers incorporating it into their process.

An alloy comprised of tin, copper, nickel and germanium, Nihon Superior said that SN100C’s properties make it possible to achieve high productivity in soldering processes to produce cost effective and reliable joints. Special features include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects.

www.nihonsuperior.co.jp