Companies Announce Participation at InterNepcon Japan 2008
16 January 2008
The 2008 InterNepcon Japan exhibition will take place at the Tokyo Big Sight from January 16-18 in Tokyo, Japan.
Comapnies that will be exhibiting include Sono-Tek Corporation, specializing in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems. The company announces that it will exhibit its systems and technologies at the show.
Another company participating is Practical Components, an international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment. The company said its products are designed to help engineers qualify their technology, and train and grow their business. On display will be the new Amkor Technology PoP (PSvfBGA) packages and body sizes, a stackable very thin fine-pitch BGA package; Amkor tsMLF (Thin Substrate Micro LeadFrame-TAPP) and the Practical Components/Aegis Industrial Software PC009-40 Traceability and Control Validation Kit.
