Advanced Technologies and Eco-Compliance to Headline IPC Professional Development Program at APEX 2008

IPC has announced that leading experts from around the world will convene in Las Vegas to share the latest findings on challenges facing the electronic interconnect industry as part of the professional development program at the 2008 IPC Printed Circuits Expo, APEX and the Designers Summit. The program will be held Sunday-Monday, March 30–31 and Thursday, April 3; the exhibition takes place April 1–3.

More than 60 full-day and half-day courses will cover a broad range of topics that are critical to all segments of the industry. “While lead free and complying with the growing list of environmental directives and regulations certainly continue to be hot topics, attendees also need to know current thinking on advanced technology, embedded components, design, quality, reliability and testing, and more,” said Jean Hebeisen, IPC Director of Professional Development. “The professional development program brings the world’s top speakers to address the industry’s top priorities.”

2008 program highlights include:

Roadmap to Regulatory Compliance: Risks, Challenges and Opportunities for the High-Tech Industry

How to Specify PCBs to Reliability Survive the RoHS-Mandated Lead-Free Soldering Processes

Lead-Free for the Exemptee – Surviving in a Lead-Free World

Rapid RoHS Assembly Development for Large and Small Boards in an RoHS Environment

True Design for Reliability: Understanding What Is and What Is Not DfR

What is HDI? Do You Need HDI? How to get Started

Implementing “Bleeding Edge” Component Technology

Achieving High Reliability for Lead-Free Solder Joints – Material Considerations

For complete course descriptions and an interactive online search by day, topic, instructor or keyword visit www.GoIPCShows.org/profdev. For additional information on professional development courses, contact Alexandra Curtis, IPC Professional Development Manager, at AlexandraCurtis@ipc.org.

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