IPC Releases Revision B of Lead Free Support and Inspection Guidelines for Repairs and Modifications
5 February 2008
IPC — Association Connecting Electronics Industries has announced the release of Revision B of IPC-7711/7721, "Rework, Modification and Repair of Electronic Assemblies". The revision involved a complete review and update of every rework and repair procedure (totaling several hundred) to ensure applicability to both lead-free and traditional tin-lead soldered assemblies.
The guide was developed in three parts. Part 1 General Requirements has been updated for ease of use and provides important direction and guidelines for all procedures including those common to rework, repair and modification. Part 2 focuses on the tools, materials and methods to be used in removing and replacing surface mount and through hole components. Part 3 details the procedures for modifying assemblies and accomplishing laminate can conductor repairs.
The 300+ page, single-volume guide is provided in a three-ring binder for easy updating and includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Color illustrations of many of the procedures have been added to help the user better understand the guide. Users can insert company-specific procedures or remove just the pages needed for a specific job to help keep the workbench clear.
For more information or to purchase IPC-7711/7721B, visit www.ipc.org/onlinestore.
