Indium Corporation’s Technology Experts Presenting at APEX
5 February 2008
Indium Corporation announces that three of its technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.
Dr. Lee will present a professional development course entitled "Achieving High Reliability for Lead-Free Solder Joints – Material Considerations". He will also participate in two technical conferences: "Future Lead-Free alloys – Meeting Challenges of Miniaturization" and "A Compliant and Creep Resistant SAC+Al (Ni) Alloy".
Dr. Lasky will be present a professional development course: "Rapid RoHS Assembly Development for Large and Small Boards in an RoHS Environment". He will also present at the technical conference "Assembly of Large PWBs in an RoHS 5, RoHS 5.5, and RoHS 6 Environment".
Tim Jensen will present at the technical conference "Improving Pb-Free Reflow Coalescence through Consistently High Solder Paste Transfer Efficiency."
