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Loctite 3508
• One component epoxy that is pre-applied to the board at the corners of the CSP pad site using astandard dispensing system • Can be applied in-line using existing capital equipment with curing taking place during the normal solder reflow process • Material allows for device self centering, is lead-free compatible and reworkable • Stable with a pot life of greater than 30 days The electronics group of Henkel
www.henkel.com/electronics
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