Universal Instruments to Highlight Technology Convergence at Nepcon Shanghai
4 March 2008
Universal Instruments announces that it will showcase its latest technology on the convergence of SMT and semiconductor packaging technology during Nepcon China to be held from April 8 to 11 at the Everbright Convention and Exhibition Center in Shanghai.
According to the company, System-in-Package (SiP) which is gaining increasing popularity in the market is a result of the new technology. It can combine several functions like wireless, logic and memory in a small module like Bluetooth and GPS.
Unovis Solutions, a subsidiary of Universal Instruments, will demonstrate its bridging solutions for all SiP applications utilizing Direct Die Feeding (DDF).
