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SMTA Announces “Best of Conference” Award for Pan Pacific 2008 Symposium
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| 7 March 2008 |
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SMTA announced that the Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Hawaii, USA was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
As rated by the attendees, the “Best of Conference” Award was given to two presenters this year. The first was awarded to Shari Farrens, PhD, SUSS MicroTec, for her presentation of “Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding”.
The second was awarded to Maaike Taklo, PhD, SINTEF ICT, for her presentation of “BCB Bonded Wireless Vibration Sensor”.
Both papers are featured in the 2008 Pan Pacific Symposium Proceedings. The 2009 Pan Pacific Conference will be held on February 10-12, 2009 in Hawaii, USA.
For more information on the Pan Pacific Microelectronics Symposium and Tabletop Exhibition, contact SMTA administrator JoAnn Stromberg at joann@smta.org.
www.smta.org
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