Universal Instruments to Demonstrate Latest Technologies at Nepcon China 2008

Universal Instruments announces that it will demonstrate the state-of-the-art surface mounting technologies, including system-in-package (SiP) applications, odd-form components solutions and high speed chip placement solutions to meet the changing needs in today’s dynamic electronic assembly market at Nepcon China 2008.

With the trend towards miniaturization and high integration, Universal Instruments said it has specially designed the Direct Die Feeding solution which can help manufacturers assemble SiP directly onto end products. The solution on display involves the company's multi-function platforms GX-11S, GI-14D, Direct Die Feeders and special functions on IR heating, UV curing, and fluxing which are required by semiconductor process and SiP assembly process.

Heinz Dommel, Asia Sales Director of Universal Instruments Corporation, said, “With the increasing popularity of SiP applications, we are expecting to see more and more manufacturers undergoing SiP assembly in their SMT production lines."

“Our Direct Die Feeding solutions on display fill the technology gap on feeding in the die onto the SMT machines at high speed with high accuracy. We are now integrating semiconductor applications into SMT lines and are foreseeing a growing convergence between semiconductor and SMT packaging technologies. Universal Instruments is pledged to continue our efforts in providing our customers the state-of-the-art technology to meet changing market demands,” he added.

SiP combines several functions like wireless communications, logic and memory into one single small module. Its application enables the production of smaller, lighter, and cheaper products with more functions and better performance. SiP is already widely applied on products including Bluetooth, cellphones, medical equipments, automobile electronics, power devices, GPS and so on.

www.uic.com