Host of Companies to Participate in the Technical Conference at APEX 2008

A host of companies have announced that they will participate in the technical conference at APEX 2008, scheduled to take place April 1-3, 2008 in Las Vegas, USA.

The technical conference held during APEX is said to be one of the finest and most selective in the world. Key industry players will present new research and innovations in the areas of board design and manufacture, and electronics assembly. Additionally, there will be sessions that focus on manufacturing software, backwards compatibility and 3-D packaging as well as the conference’s annual focus on key areas such as soldering, assembly processes, advanced packaging, materials and reliability.

Kyzen Corporation's CTO Mike Bixenman will present the paper, “Engineered Cleaning Fluids Designed for Batch Processing” in the Cleaning tract.

Optimal Electronics Corporation's Founder, President, and CTO Dr Ranko Vujosevic will present a case study on ‘Lean Kitting’ under the heading of Business II: Optimizing Your Return.

Kester’s Peter Biocca, Senior Market Development Engineer, will moderate the Backward Compatibility: Where Leaded and Lead-Free Collide tract of the technical conference. He will also moderate the Cleaning tract of the technical conference program.

Nihon Superior’s Senior Technical Adviser, Keith Sweatman will present a paper, “Properties that are Important in a Lead-free Solder”. The company will seek to share their experience in identifying properties that they believe are relevant to the performance of an alloy as a reliable, user-friendly and cost-effective lead-free solder.

Source: MW Associates