|
Nihon Superior Co. Ltd. announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate. An agreement covering this collaboration was signed on February 7, 2008 and the project, which will begin in April 2008, is expected to continue until March 2012 with the companyproviding around AU$313,000 each year over that period. www.nihonsuperior.co.jp
| 
