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IPC—Association Connecting Electronics Industries announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly. The program will be based on IPCA- 610, Acceptability of Electronic Assemblies; IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies; and IPC7711/7721, Rework, Modification and Repair of Electronic Assemblies and will be offered at approximately 500 secondary vocational schools throughout China. “IPC appreciates the opportunity to work with the most prestigious university in China in preparing tomorrow’s workforce,” said David Bergman, IPC Vice President of International Relations. “Through the reach of Tsinghua University, we hope to spread the knowledge of IPC to 5,000 students annually; educating them on soldering and printed board assembly quality inspection and promoting standards in advanced electronics manufacturing technology.” The Skill Development Program for Electronics Assembly is expected to roll out later this year. www.ipc.org | 
