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PowerstrateXtreme Dispensable(PSX-D) • To address the emerging requirements of today’s heat generating devices • Incorporates phase change performance into a liquid product • Can be needle dispensed or manually applied onto a heat sink or other surfaces • Optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks • Reworkable and repeatable making it well suited for both lidded and bare die processor applications The electronics group of Henkel
www.henkel.com/electronics
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