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Fineplacer CRS7.MD • Suitable for typical rework applications of mobile devices like cell phones, PDAs or handhelds • Simple “plug & go” concept, putting emphasis on quick setup and easy operation • For rework of BGA, CSP, QFN, MLF, Package-on-Package, RF-shield frames or connectors as well as small passives downto 0201 • Capable of component desoldering, residual solder removal, paste printing, reballing, placement and soldering of the new component • Comes with reflow software featuring advanced soldering profile management as well as process recording, reporting and capturing functions Finetech GmbH
www.finetech.de
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