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SN100C • Tin-copper-nickel-germanium alloy • Possible in combination with the right core flux (030) to complete more than 35 average joints per minute with a tip temperature of 380°C • Can be reflowed at a lower superheat above liquidus thanSAC alloys • Available as eCore low-spatter lead-free flux-cored solder wire; • ePaste no-clean solder paste for general reflow purposes and special low voiding paste for critical applications such as die attach; and • eBalls for flip chip and area array packages Nihon Superior
www.nihonsuperior.co.jp
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