Endicott Interconnect and Unimicron Technology Sign Sales and Manufacturing Agreement

Endicott Interconnect Technologies Inc. (EI) announced that they have entered into a sales and manufacturing agreement with Unimicron Technology Corp. to produce CoreEZ organic substrates at one of their Taiwanese facilities. Under terms of the agreement, EI, as the original design manufacturer, maintains control of the design and technical support worldwide for the CoreEZ product line. Unimicron will be the high volume manufacturer of CoreEZ products per EI’s specifications and requirements. Sales of CoreEZ product will be jointly handled by the two companies.

“We are very excited about this opportunity to partner with Unimicron. We believe their sales and marketing infrastructure, skilled workforce and world-class facilities will provide an efficient manufacturing process to our customers worldwide,” commented Michael J. Hills, Senior VP Sales, Marketing and Business Development at EI. “Working with Unimicron allows us to offer high volume production and manufacturing in a low cost region. We anticipate an increase in design wins and the associated new product introduction activity, which positively affects the proliferation of CoreEZ into the marketplace,” he added.

“We look forward to our engagement in this innovative build-up substrate sales and manufacturing initiative with EI,” stated David Cheng, Executive President of Unimicron IC Carrier Group.

According to the company, CoreEZ organic substrates offer a very dense, thin core, build-up flip chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set. It is well suited to high speed graphics and microprocessor applications.

www.endicottinterconnect.com