ViTechnology and Synapse Imaging Sign Partnership on 3D SPI Systems
7 April 2008
ViTechnology announced the signature of a partnership with Korean Company Synapse Imaging, specialized in 3D optical inspection.
Synapse Imaging and Vi Technology will work in partnership to offer an industrial solution for 3D Solder Paste Inspection (3D SPI). Together with Synapse Imaging's FAHP (Flying Absolute Height Profilometry), VI Technology said it will use its experience in AOI to promote develop and support its business worldwide.
The new system “Vi Technology 3D SPI by synapse” was officially launched at APEX (Las Vegas, April 1st – 3rd). It will be integrated into the Vi Technology Product range to offer a complete SMD line AOI solution from Solder Paste Inspection (2D and 3D), pre-reflow Inspection with close loop control to Post-Reflow Inspection including latest enhancements such as Profiler, the company said.
“This partnership seals a long term collaboration between both companies”, explained Jean-Yves Gomez, Vi Technology CEO, “with the goal of offering solutions for our customers which help them to improve their quality and productivity”.
“The success of 3D SPI depends on” said Jason Kim, Synapse Imaging CEO, “how exactly proving the relation between solder paste qualities and the final assembly defects. The synergy effect by this partnership will lead the growth of 3D SPI market through fully connecting the front-end process control to the back-end process control.”
