Nihon Superior to Present During International Tin Conference

Nihon Superior Co Ltd, an advanced soldering and brazing supplier to the worldwide market, announces that it will present at the International Tin Conference, scheduled to take place April 14-17, 2008 at the Intercontinental Hotel in Hong Kong.

The question of whether silver is an essential ingredient in lead-free soldering is one that Keith Sweatman, a technical adviser to Japanese solder maker Nihon Superior Co Ltd, will consider in his paper, “Tin, The Essential Ingredient in Lead-free Solder — But Do You Also Need Silver?,” that he will be present during the conference.

As far as Nihon Superior is concerned, the answer is a definite “no” because its lead-free solder, SN100C, contains no silver. For many people in the electronics industry, however, this remains a controversial question, and in his presentation Sweatman will review the issues that must be considered in formulating lead-free solders, including the cases for and against the inclusion of silver in these high-tin alloys.

While the paper primarily relates to the technical performance of the solder, Sweatman will point out to the tin producers attending the conference that the increase in the cost of solder that results from the inclusion of silver in its formulation may prompt the electronics industry to look for alternatives to soldering as a method of assembling electronic circuitry. The paper also will discuss the most reliable method of making the connections required in electronic circuitry solder.

In describing the paper, Sweatman said, “There is definitely a place for silver in the new generation of solders that have had to be developed in response to the effective ban on lead imposed by the EU’s Directive on the Restriction of Hazardous Substances in electrical and electronic equipment. However, as has been demonstrated by the success of the Nihon Superior SN100C alloy, there are a wide range of applications where a silver addition is not required so that the electronics industry can have a more cost-effective solution that does not compromise performance or reliability.”

The International Tin Conference, held in association with ITRI Innovation Ltd, will not only focus on the global supply of tin, with presentations looking at international production developments and new project exploration, but will also concentrate on a wide range of tin consumption sectors, including chemicals, solder and electronics, as well as investigating the potential for a range of new applications using tin.

www.nihonsuperior.co.jp