IPC Offers Look into Future Advanced Packaging Technology

IPC — Association Connecting Electronics Industries will bring electronics industry leaders together to discuss and assess key enabling technologies and industry dynamics that are driving advanced packaging techniques during a “future advanced packaging technology” seminar on June 2, 2008 in Sunnyvale, Calif, USA.

“Attendees will be updated on current and future technology solutions,” says Jean Hebeisen, IPC Director of Professional Development. “In addition, they’ll also hear projections as to where advanced packaging techniques are headed both in design and manufacturing. This seminar will serve as an invaluable tool to attendees in crafting their companies’ business and technical strategies.”

The technical conference agenda includes such topics as: semiconductor packaging roadmaps, IC packaging technologies, signal integrity, operating environment requirements, prototype versus production and more.

Following the seminar on June 2, Tessera Technologies will host a two-day design for advanced packaging seminar on June 3–4, 2008 in San Jose. The workshop will cover many of the challenges and risks associated with making the right decisions to adapt the newer component package innovations.

For additional information on the seminar and workshop, visit www.ipc.org/AdvPack0608 or contact Alexandra Curtis, IPC Manager of Professional Development at AlexandraCurtis@ipc.org.

www.ipc.org