SMTA International 2008 to Feature Lead-Free Soldering Technology Symposium
28 April 2008
The SMTA has announced the return of their Lead-Free Symposium, scheduled to run during their annual conference, SMTA International, at Disney’s Coronado Springs Resort and Convention Center in Orlando, Florida, USA from August 17-21. Being held for the 8th consecutive year, some of the industry’s finest Lead-Free research is presented at this symposium, according to SMTA.
Organized by Dr Paul T Vianco of Sandia National Labs, the Lead-Free Soldering Technology Symposium will begin with a full session describing the latest consortium activities by the iNEMI group. Of particular interest will be a discussion of methodologies to evaluate the many new alloy compositions for different product applications. Sessions two and three are devoted to the very popular topic of case-studies. Six papers will describe the actual experiences of companies currently at the forefront of implementing a lead-free solder solution for consumer and high-reliability products. Session four provides attendees with state-of-the-art information pertaining to lead-free interconnection reliability.
Specific course topics will range from the latest test data on the thermal cycling and shock testing of various alloy compositions and package designs, to forwards and backwards compatibility issues that remain as a significant concern for companies making high-reliability products.
For more information, contact Melissa Serres Marx at melissa@smta.org.
