IPC and Jisso International Council Sponsor Technical Seminar

IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, Implementing Advanced Interconnect Technology Solutions, May 21–22, 2008, in Atlanta, USA. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies used in electronic products. Members of JIC and technology leaders from industry will speak on environment-friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.
According to IPC, attendees will gain a comprehensive view of both integrated electronics development and manufacturing, in addition to valuable insight on interconnect technologies that will impact the electronics industry over the next ten years. Seven sessions, moderated by industry’s leading experts in interconnection technologies, will comprise the two-day event. Session topics include an overview of the major areas of the total package solution; the total package solution by Jisso level; reliability and quality; thermal management solutions: energy conservation and generation; nano materials; printed and embedded electronics; and, SiP, TSVs and 3D packaging.

“This seminar is a must for any professional wanting an in-depth understanding of the key issues in electronic interconnections,” says Jean Hebeisen, IPC Director of Professional Development. “It’s the perfect opportunity for those interested in the total solution for interconnecting, assembling, packaging, mounting, and integrating system design.”

For more information on this seminar or to register, visit www.ipc.org/JF0508 or contact Michelle Michelotti, Professional Development Coordinator, at MichelleMichelotti@ipc.org.

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