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Fineplacer CRS 10 • Designed specifically for customers needing a fixed configuration, with quick set upand easy operation • Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards • Applications include BGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small passives, connectors, RF-shields, shielding frame, flip chip rework as well as customized applications • Equipped with Controlled Mixed Soldering System reflow module for top heating and full-area bottom heating • Better than 10μm placement accuracy allows the system to be used for the smallest components with pitches down to 100μm Finetech GmbH
www.finetech.de
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