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G3 SPA 1000 • Designed to help OEMs avoid offshore solder paste defect issues • Quantitative measurement of solder paste condition in accordance with the five solder paste tests of the IEC and IPC international standards bodies from a single platform plus anadditional sixth Open Time test • Performs all solder quality testing detailed by IEC and IPC international standards including: slump; solder ball; tack and wetting in accordance with IEC 61189-5 and the IPC-TM-650 spread test; and • Gen3’s own Open Time test to check the integrity of solder paste that has been sitting exposed (open) to the atmosphere while “in-use” on an assembly line Gen3 Systems
www.gen3systems.com
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