RTI International Plans to Commercialize Silicon Circuit Board Technology
12 June 2008
An innovative technology developed at RTI International that promises to increase computer performance while reducing the size of circuits and power requirements has been spun off to form a new company, initially called Beeco Inc.
The technology allows bare die integrated circuits to be densely populated onto a large area silicon substrate, replacing the current method of putting packaged die onto a conventional printed circuit board. The innovation allows a smaller overall system to deliver higher performance at reduced size.
The company, led by President and CEO John Goehrke and financed by RTI and venture capital firm Intersouth Partners, will initially apply the technology to the reconfigurable computing market, in which high performance, low power, and small size are critical.
"We are pleased to see this innovative technology take the next step and enter the commercial marketplace where its potential can be applied in real world settings and products," said RTI International President and CEO Victoria Haynes. "We are optimistic that the work our scientists and engineers have invested in this technology will lead to significant advances in computing technology and innovative circuit board development."
In the coming months, the company will work to expand its management team and focus on product development.
"Industry demands for smaller, faster and more energy efficient electronics create some very exciting possibilities for this new technology," Goehrke said. "With important development work at RTI behind us and the support of strong financial partners, we look forward to launching and growing the company."
The new company is the third company created in the past eight years to commercialize technologies developed in RTI’s laboratories.
Ziptronix was founded in October 2000 to commercialize an integrated circuit wafer and die bonding technology.
In 2005, Nextreme Thermal Solutions was formed to commercialize micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries.
