Universal Instruments Organizes Advanced SMT Lab Open Day
30 June 2008
With the miniaturization and growing complexity of electronics components, there are increasing applications of System-in-Package, flip chip, 0201/01005 SMT assembly and stacking technology in the manufacturing process.
Universal Instruments announces that it is going to organise a two-day open house program with four sessions at its Advanced Process Lab in Shanghai, from July 24 to 25, demonstrating the above mentioned technologies to participants.
On top of the standard solutions demonstration and seminars, participants are asked to bring along their own samples to ask the company's technical staff for a tailor-made solution.
Interested parties can sign up by sending emails to almiranz@uic.com asking for a registration form or going to www.uic.com/chinese to download a form.
