Mentor Graphics Publishes New Technology Book On BGA Routing

Mentor Graphics Corporation announced the publication of a new book written by Charles Pfeil, Engineering Director of Mentor’s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA. The publication explores the impact of dense ball-grid array (BGA) packages with high pin-count on PCB (printed circuit board) design, and provides solutions for inherent design challenges.

“Using a BGA is the most common method today for packaging a high pin-count or very dense application specific integrated circuits (ASIC) and field programmable gate arrays (FPGA). BGAs have been proved to be a reliable, cost-effective package while at the same time providing flexibility to address miniaturization and functional requirements,” said author Charles Pfeil. “However, as BGA density and pin count continue to increase, the designer’s ability to effectively design with the devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process.”

These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices.

“We are proud to offer this in-depth look at the future enhancements of BGA technology,” said Dan Boncella, Director of Marketing, System Design Division, Mentor Graphics Corporation. “We continue to research and develop products for our customers with cutting-edge technologies providing designers with the tools necessary to enhance productivity and bring to market cost-effectively.”

To obtain a copy of BGA Breakouts and Routing, or to learn more about upcoming discussions, events and articles about BGAs and Mentor’s solutions to automating the design process for these complex, leading edge packages, visit, www.mentor.com/go/bga or contact Charles directly at bga_info@mentor.com .

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