Fraunhofer Report Affirms Performance of Ovation’s Board Support Technology
8 July 2008
Ovation Products announced that the results of a study conducted by the Fraunhofer Institute and commissioned by leading German electronics distributor, Ben Technologies, have confirmed the performance of the company’s HD Grid-Lok reconfigurable tooling technology in modern electronics production.
According to Ovation, scientists at Fraunhofer used a 240 x 135 x 1.6mm printed circuit board (PCB) mounted with a variety of fine-pitch SMT components including 0805, 0402 and 0201 passive devices as well as QFPs, flip chips and BGAs. The goal of the analysis was to determine the maximum occurring print loads on the device surfaces located on the underside of the PCB. For evaluation, pressure sensors were used to monitor components on the bottom side of the board, with measurements taken at eight different points to examine pressure load on the devices in the Z direction. Squeegee pressure was systematically increased from 40 Newtons (N) to 160N over several print passes and results showed no damage to any of the devices.
“The study’s findings certainly were no surprise to us,” says Benjamin Englmaier of Ben Technologies. “We’ve seen first-hand the benefits of HD Grid-Lok and commissioned this study simply to add further proof of the technology’s advantages. In our view, there is now definitely no disputing HD Grid-Lok’s superior performance.”
For more information or for a copy of the full report, contact Ovation Global Product Manager, Paddy Ash, at pash@grid-lok.com.
