Vertical Circuits and Asymtek Enable Next Generation 3D Interconnect Technology

Vertical Circuits Inc (VCI), a supplier of advanced 3D die-level interconnect solutions, announced its recognition of Asymtek, a Nordson company and provider of dispensing, coating and jetting technologies, as a “Partner in Innovation.” Asymtek’s Axiom automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI’s 3D vertical interconnect process, the company said.

Vertical Circuits said its patented vertical interconnect pillar (VIP) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. It enables IC manufacturers to deliver stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIP conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom dispenser.

“It has been a pleasure to work with the world leader in precision electronic material dispensing,” said Simon McElrea, Vertical Circuits’ Vice President of Product Development. “By leveraging Asymtek’s proven fluid-jetting technology, originally developed for flip chip applications and incorporated into Asymtek’s Axiom platform, we have been able to offer a plug-and-play, VCI VIP ready, solution to our manufacturing partners. The simple user interface, patented fluid control features and proven equipment reliability are exemplary in our industry. The Axiom solution makes the adoption of our technology into existing assembly lines seamless and straight forward.”

“VCI's VIP technology provides a more cost-effective and high-yield solution for interconnecting stacked die by using Asymtek’s proven jetting capabilities,” comments Alec Babiarz, President, New Business Development, Asymtek. “Asymtek and other equipment partners are well positioned to provide customers the global service and support they require. We look forward to more industry adoption of the VIP technology.”

Vertical Circuits has licensed its VIP technology to leading global device manufacturers and packaging companies. The technology is well suited for high capacity removable, as well as embedded, flash memory applications, including a broad array of memory cards, USB memory, and emerging SSD products. In addition, the low inductance, high performance, characteristics of the VIP conductors also make them well suited for DDR2/3 modules, memory/logic device stacks, and specialty device applications, the company said.

www.verticalcircuits.com
www.asymtek.com